Thermoelectric　property　and　stress　distribution　were　simulated　by　ANSYS　software　to　provide　the　groundwork　of　device　preparation　based　the　material　experiment.　The　computed　results　showed　that　the　heat　stress　of　the　device　was　distributed　on　the　contact　surface　of　different　materials.　It　reached　the　highest　refrigeration　efficiency　of　0.24　with　the　condition　of　current　9　A,　0　on　the　cold　face　and　50　difference.　The　highest　refrigeration　capacity　was　1.33　W　with　the　current　of　10　A　and　the　shakeout　temperature　was　equivalent.　The　refrigeration　efficiency　and　capacity　were　sharply　decreased　considering　the　contact　resistance.　The　thermoelectric　efficiency　was　only　0.03　with　20　on　the　cold　face　and　10　difference.　A　planer　thermoelectric　device　contained　7　pairs　of　thermoelectric　couple　was　successfully　fabricated　after　improving　the　fabrication　process,　which　provide　a　theoretical　direction　for　the　subsequent　fabrication　of　thermoelectric　generators.　©　2019,　Materials　Review　Magazine.　All　right　reserved.