Glass　has　emerged　as　a　highly　versatile　substrate　for　various　sensor　and　MEMS　packaging　applications,　including　electromechanical,　thermal,　optical,　biomedical,　and　RF　devices,　due　to　its　exceptional　properties　such　as　high　geometrical　tolerances,　outstanding　heat　and　chemical　resistance,　excellent　high-frequency　electrical　properties,　and　the　ability　to　be　hermetically　sealed.　In　these　applications,　Through　Glass　Via　(TGV)　technology　plays　a　vital　role　in　manufacturing　and　packaging　by　creating　electrical　interconnections　through　glass　substrates.　This　paper　provides　a　comprehensive　summary　of　the　research　progress　in　TGV　fabrication　along　with　its　integrations,　including　through　via　formation　and　metallization.　This　paper　also　reviews　the　significant　qualification　and　reliability　achievements　obtained　by　the　scientific　community　for　TGV　technology.　Additionally,　this　paper　summarizes　the　application　of　TGV　technology　in　various　sensors　such　as　MEMS　sensors　and　discusses　the　potential　applications　and　future　development　directions　of　TGV　technology.