The　2.5D　package　is　intended　to　deliver　increased　IO　density　and　high　frequency　electrical　performance　while　meeting　cost　requirements.　It　achieves　chip　heterogeneous　integration　capabilities　through　the　interposer.　However,　some　warpage　will　always　occur　during　the　molding　process　because　of　the　different　coefficients　of　thermal　expansion　between　the　chip　and　the　molding　compound.　One　of　the　challenges　is　predicting　and　controlling　wafer　warpage.　This　paper　focuses　on　wafer　warpage　prediction　and　optimization　of　the　through　glass　via　(TGV)　interposer.　The　plate　and　shell　bending　theory　and　composite　material　equivalence　method　are　introduced　in　the　discussion　of　the　wafer　warpage　problem.　A　set　of　wafer-level　warpage　theoretical　calculation　model　is　proposed,　and　the　calculation　accuracy　of　the　warpage　theoretical　model　is　verified　by　finite　element　simulation　and　experiment.　Meanwhile,　its　actual　engineering　application　is　given　to　provide　direction　for　the　design　of　wafer　level　packaging　products　for　TGV　interposer.　IEEE