Glass　substrates　are　set　to　become　a　critical　material　in　advanced　packaging　technologies　due　to　their　superior　high-frequency　electrical　properties,　thermal　stability,　and　chemical　durability.　This　paper　examines　the　roles　and　advantages　of　glass　substrates　in　the　packaging　process,　highlighting　their　applications　in　intermediary　layers,　fan-out　packaging,　micro-electro-mechanical　system　packaging,　and　integrated　antenna　packaging.　This　paper　also　summarizes　the　common　composition　and　key　physicochemical　properties　of　glass　substrates　used　in　chip　packaging,　and　provides　insights　into　their　future　development.　©　2025　Bulletin　of　the　Chinese　Ceramic　Society　Press.　All　rights　reserved.