With　the　continuous　development　of　chip　technology　integration,　chip　heating　and　power　consumption　has　become　a　serious　problem　affecting　the　system　reliability.　The　chip　junction　temperature　monitoring　and　increase　in　power　consumption　have　become　very　important　especially　for　the　DSP　chips　with　low　power　meter　requirements.　In　this　paper,　a　new　measurement　method　for　junction　temperature　and　power　consumption　of　DSP　devices　is　designed　based　on　the　CCS　platform.　It　can　realize　the　realtime　and　accurate　monitoring　of　chip　junction　temperature　and　power　consumption.　A　variety　of　feasibility　tests　were　carried　out　by　varying　its　temperature　stress　and　the　load　condition　of　the　MSP430FR5969　chip.　The　test　condition　was　calibrated　and　verified　with　Energy　Trace　technology,　and　the　power　consumption　and　junction　temperature　curves　under　different　load　conditions　were　obtained　along　with　the　temperature　boundary.　This　method　provides　an　important　reference　for　the　reliability　research　and　low　power　design　of　DSP　chip.　©　2023　IEEE.