The　effect　of　adding　trace　elements　of　Ni,　P　and　Ce　on　the　oxidation　resistance　and　solidification　crack　of　SAC305　solder　alloys　is　investigated.　Experimental　results　indicate　that　adding　Ni　can　decrease　the　length　of　solidification　crack　and　depress　the　formation　of　the　crack,　but　can　not　improve　the　oxidation　resistance　of　SAC305　solder　alloy.　Trace　P　addition,　which　forms　a　dense　oxidation　barrier　on　the　surface　of　the　solder,　can　improve　the　oxidation　resistance　of　solder,　but　aggravates　the　formation　of　solidification　crack　on　the　surface　of　solder　alloys.　Addition　of　Ce　can　deteriorate　the　oxidation　resistance　of　SAC305　solder　alloy　and　slightly　depress　the　solidification　crack　on　the　surface　of　the　alloys.