Indexed by：
Abstract：
The silicon layer containing through silicon vias (TSVs) is considered as anisotropic fiber reinforced composite layer with different longitudinal and transversal properties. An analytical approach is presented to estimate the effective Young＇s modulus, Poisson＇s ratio and coefficient of thermal expansion (CTE) for composite layer. It shows that the TSVs have no significant influence on the deflection of silicon layer, and the model ignoring TSVs is capable to predict enough accurate deflection of silicon layer. © 2012 IEEE.
Keyword：
Reprint Author's Address：
Email：
Source ：
Year： 2012
Page： 583-587
Language： English
Cited Count：
SCOPUS Cited Count： 4
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 8
Affiliated Colleges：
