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Abstract：
The reliability of power LEDs has strong dependence on successful package thermal management. In this paper, heating response curves of LEDs were recorded by the temperature sensitive parameter (TSP) method and fast-switching circuit techniques. It provided a novel method to analyze thermal resistance composition of power LED＇s packaging. Cover-and-block method was presented to provide a correction to the apparent thermal resistance of optical devices, and an electrical method to obtain radiant efficiency was also put forward. © 2008 IEEE.
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Year： 2008
Page： 1211-1214
Language： English
Cited Count：
WoS CC Cited Count： 0
SCOPUS Cited Count： 4
ESI Highly Cited Papers on the List： 0 Unfold All
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Chinese Cited Count：
30 Days PV： 6
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