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Author:

Bai, Shi (Bai, Shi.) | Zhou, Weiping (Zhou, Weiping.) | Hou, Tingxiu (Hou, Tingxiu.) | Hu, Anming (Hu, Anming.)

Indexed by:

EI Scopus SCIE

Abstract:

There are increasing interests in flexible electronic devices for sports, entertainment, health monitoring and medical cares. In particular, flexible sensors (wearable strain senor or robotic controllable sensors) attached on clothing or human skins could be used as a motion detector. Copper has been considered as a potential alternative material for other expensive noble metals. By laser-induced direct reduction and transfer printing, microsensors based on conducting copper circuits was fabricated on polydimethylsiloxane or polyimide as cheap and sensitive devices. A specific electrical resistivity of 240 mu Omega center dot cm of Cu circuit was successfully achieved in an electrode of about 40 mu m in thickness. We demonstrate a motion sensing based on laser-reduced copper circuits with a high sensitivity and mechanical robustness.

Keyword:

flexible device flexible sensor laser direct writing laser reduction copper circuit

Author Community:

  • [ 1 ] [Bai, Shi]Beijing Univ Technol, Inst Laser Engn, 100 Pingle Yuan, Beijing 100124, Peoples R China
  • [ 2 ] [Zhou, Weiping]Beijing Univ Technol, Inst Laser Engn, 100 Pingle Yuan, Beijing 100124, Peoples R China
  • [ 3 ] [Hou, Tingxiu]Beijing Univ Technol, Inst Laser Engn, 100 Pingle Yuan, Beijing 100124, Peoples R China
  • [ 4 ] [Hu, Anming]Beijing Univ Technol, Inst Laser Engn, 100 Pingle Yuan, Beijing 100124, Peoples R China
  • [ 5 ] [Hu, Anming]Univ Tennessee Knoxville, Dept Mech Aerosp & Biomed Engn, 1512 Middle Dr, Knoxville, TN 37996 USA

Reprint Author's Address:

  • [Hu, Anming]Beijing Univ Technol, Inst Laser Engn, 100 Pingle Yuan, Beijing 100124, Peoples R China;;[Hu, Anming]Univ Tennessee Knoxville, Dept Mech Aerosp & Biomed Engn, 1512 Middle Dr, Knoxville, TN 37996 USA

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Source :

JOURNAL OF LASER MICRO NANOENGINEERING

ISSN: 1880-0688

Year: 2016

Issue: 3

Volume: 11

Page: 333-336

1 . 1 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:305

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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