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Author:

Liu, Xiao-Dong (Liu, Xiao-Dong.) | Shang, De-Guang (Shang, De-Guang.) (Scholars:尚德广) | Zhang, Li-Hong (Zhang, Li-Hong.) | Chen, Tao (Chen, Tao.) | Guo, Y. B. (Guo, Y. B..) | Barkey, M. E. (Barkey, M. E..)

Indexed by:

EI Scopus SCIE

Abstract:

A healing method for fatigue damage was studied by laser shock peening (LSP) with excimer laser for polycrystalline copper film. It is found that the reduction of plastic strain range due to laser shock peening could be responsible in the improvement of residual fatigue lives for the damaged specimens by LSP, and the degree of reduction in plastic strain range for the damaged specimens by LSP is more evident when the stress range is larger. According to the variation of the fatigue ductility of the specimen before and after LSP, a unified damage-healing model is proposed during the damage-healing process for copper specimens. The predicted lives by the proposed method agree well with the experimental results. (C) 2014 Elsevier Ltd. All rights reserved.

Keyword:

Fatigue ductility Healing Laser shock peening Plastic strain range Fatigue damage

Author Community:

  • [ 1 ] [Liu, Xiao-Dong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Li-Hong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Chen, Tao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Guo, Y. B.]Univ Alabama, Dept Mech Engn, Tuscaloosa, AL 35487 USA
  • [ 6 ] [Barkey, M. E.]Univ Alabama, Dept Aerosp Engn & Mech, Tuscaloosa, AL 35487 USA

Reprint Author's Address:

  • 尚德广

    [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF FATIGUE

ISSN: 0142-1123

Year: 2014

Volume: 63

Page: 145-153

6 . 0 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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