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Author:

杜斌 (杜斌.) | 鲁燕萍 (鲁燕萍.) | 雷永平 (雷永平.) (Scholars:雷永平) | 杨艳玲 (杨艳玲.) (Scholars:杨艳玲) | 杨华猛 (杨华猛.)

Abstract:

本文研制出一种性能优异的适用于Sn_(1.0)Ag_(0.5)Cu焊膏的无卤素松香型助焊剂,用润湿性和腐蚀性作为衡量标准,并按照助焊剂的主要性能指标对这三种配方进行了综合性能评价。

Keyword:

松香型助焊剂 活化剂 无铅焊膏

Author Community:

  • [ 1 ] 北京真空电子技术研究所
  • [ 2 ] 北京工业大学材料与工程学院

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Source :

Year: 2011

Issue: 总第293期

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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