Abstract:
本文研制出一种性能优异的适用于Sn_(1.0)Ag_(0.5)Cu焊膏的无卤素松香型助焊剂,用润湿性和腐蚀性作为衡量标准,并按照助焊剂的主要性能指标对这三种配方进行了综合性能评价。
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Year: 2011
Issue: 总第293期
Language: Chinese
Cited Count:
WoS CC Cited Count: 0
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ESI Highly Cited Papers on the List: 0 Unfold All
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30 Days PV: 9