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Author:

陈树君 (陈树君.) (Scholars:陈树君) | 吴日光 (吴日光.) | 陈建辉 (陈建辉.) | 于洋 (于洋.)

Abstract:

对有源功率因数校正电路的三种boost拓扑方案—硬开关、无源软开关和有源软开关进行介绍和分析,并分别采用三种拓扑研制出4KW功率因数校正装置,分别对三者做效率、谐波畸变率、功率因数、EMI测试对比。在焊接电源之前加上本文研究的有源功率因素校正装置之后进行了输入性能测试。

Keyword:

硬开关 EMI 无源/有源软开关 功率因数

Author Community:

  • [ 1 ] 北京工业大学焊接技术研究所

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Source :

Year: 2011

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 13

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