To　protect　natural　resources　and　avoid　environmental　pollution,　an　effective　method　is　proposed　to　recover　tin　(Sn)　from　waste　printed　circuit　boards　(WPCBs).　In　order　to　realize　the　efficient　recovery　of　Sn,　it　is　necessary　to　study　the　effects　of　experimental　parameters　on　Sn　leaching　and　understand　the　leaching　kinetics　of　leaching　processes.　The　statistical　and　mathematical　technique　(response　surface　methodology　(RSM))　was　used　to　study　the　effects　of　interactions　of　experimental　parameters　on　the　leaching　rate　and　optimize　experimental　parameters.　Moreover,　a　comprehensive　understanding　of　the　leaching　kinetics　of　Sn　in　hydrochloric　acid　solution　was　obtained.　The　results　show　that　the　maximum　Sn　leaching　rate　was　97.6%　which　was　obtained　under　the　following　optimal　condition:　74.1　degrees　C,　4.94　mol/L　HCl,　495.5　rpm,　and　a　solid-liquid　ratio　of　0.08　g/mL.　The　leaching　mechanism　of　Sn　was　controlled　by　mixed　control　reaction　with　an　activation　energy　of　20.3　kJ/mol.　A　macroscopic　kinetic　equation　was　also　established,　which　summarizes　the　relationships　between　the　experimental　parameters　and　the　leaching　rates　and　can　predict　leaching　results.　The　Sn　in　pregnant　leach　solution　was　recovered　as　stannic　oxide　(SnO2)　by　precipitation-high　temperature　calcining　technique.　In　this　paper,　a　complete　flowsheet　for　Sn　recovery　from　WPCBs　was　developed.