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Author:

Wang, Si-Cong (Wang, Si-Cong.) | Ji, Ling-Fei (Ji, Ling-Fei.) (Scholars:季凌飞) | Wu, Yan (Wu, Yan.) | Zhang, Yong-Zhe (Zhang, Yong-Zhe.) (Scholars:张永哲) | Yan, Yin-Zhou (Yan, Yin-Zhou.) (Scholars:闫胤洲)

Indexed by:

EI Scopus PKU CSCD

Abstract:

As a typical material of the third-generation semiconductor with wide band gap, high thermal conductivity and high critical breakdown electric field, silicon carbide(SiC) has a huge potential in the applications of photoelectric devices that can work in some extreme conditions, such as in a high temperature or intense radiation environment. Here, the research status of luminescence properties and applications of SiC was summarized. The preparation methods and characteristic luminescence of monocrystal, nanocrystalline and thin film of SiC were presented. Besides, the progress and prospect of SiC luminescence control was also discussed in this paper. Utilizing the emerging technologies, we will be able to modify SiC's properties like luminescence spectrum and efficiency. © 2017, Journal of Materials Engineering. All right reserved.

Keyword:

Silicon carbide Energy gap Luminescence of inorganic solids Semiconductor devices Nanocrystalline materials Thermal conductivity High temperature applications Film preparation Luminescence Nanocrystals Electric fields Wide band gap semiconductors

Author Community:

  • [ 1 ] [Wang, Si-Cong]Institute of Laser Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Ji, Ling-Fei]Institute of Laser Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Wu, Yan]Institute of Laser Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Zhang, Yong-Zhe]College of Materials Science and Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Yan, Yin-Zhou]Institute of Laser Engineering, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 季凌飞

    [ji, ling-fei]institute of laser engineering, beijing university of technology, beijing; 100124, china

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Source :

Journal of Materials Engineering

ISSN: 1001-4381

Year: 2017

Issue: 2

Volume: 45

Page: 102-111

Cited Count:

WoS CC Cited Count: 11

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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