Ag-Cu　nanoparticles,　integrating　the　advantages　of　Ag　and　Cu,　are　promising　materials　for　power　electronic　packaging.　In　this　work,　a　novel　dual-beam　pulsed　laser　deposition　method　was　proposed　to　prepare　an　Ag-Cu　nanoparticle　film　with　various　component　ratios　and　used　for　die　attach　at　low　temperatures.　The　as-deposited　Ag-Cu　nanoparticle　film　was　mainly　composed　of　Ag-Cu　solid　solution,　Ag　element,　and　Cu　element,　and　most　of　the　nanoparticles　were　in　the　alloying　state.　The　Ag-Cu　sintered　joint　presented　a　dense　microstructure　with　10.8%　porosity,　and　the　shear　strength　of　Ag-Cu　sintered　joints　could　reach　60　MPa　at　250　C-degrees.　The　sintered　joint　porosity　increased　as　more　Cu　were　added　in　the　Ag-Cu　nanoparticle　film,　resulting　in　a　decrease　in　the　interfacial　connection　ratio.　The　fracture　mode　of　sintered　joints　gradually　changed　from　the　sintered　layer　to　the　mixed　sintered　layer　and　interface　fracture.　The　dual-beam　pulsed　laser　deposition　method　could　guide　in　designing　the　component　ratios　of　bimetallic　nanoparticles.