Achieving　high　strength　and　reliable　bonding　below　150°C　using　Ag　nanoparticle　pastes　is　still　a　challenge.　This　work　developed　an　organic-free　nano-Ag　multilayer　film　consisting　of　a　compact　layer　and　a　loose　layer　using　pulsed　laser　deposition　(PLD).　A　high　shear　strength　of　71.2 MPa　was　achieved　with　bonding　at　150°C,　well　above　the　reported　values.　A　value　of　18.6 MPa　was　achieved　even　with　bonding　at　50°C,　meeting　the　MIL-STD-883 K　standard　requirement.　The　shear　strength　of　sintered　joints　was　strongly　dependent　on　the　diffusion　behavior　and　microstructure　evolution　of　loose　layers.　The　sub-10-nanometer　grains　and　high　quantity　of　lattice　disorders　in　the　Ag　nanoparticles　induced　a　high　diffusion　driving　force,　ensuring　high-strength　bonding　inside　the　bondline.　In　addition,　pre-bonding　and　nano-bump　effects　of　the　deposited　compact　layer　enhanced　the　interfacial　bonding　between　bondline　and　metalized　surfaces.　This　work　provides　a　promising　method　for　robust　die　attachment　below　150°C.　©　2023,　The　Minerals,　Metals　&　Materials　Society.