Nano-Ag　paste　sintering　has　attracted　much　attention　for　high-power　electronics　packaging　owing　to　its　excellent　electrical　conductivity,　thermal　conductivity,　and　oxidation　resistance.　However,　it　requires　printing　and　pre-heating　before　the　die　attach　process,　and　the　organics　in　the　paste　do　not　evaporate　easily　for　large-area　die　attachment.　In　this　work,　a　nano-Ag　film　(similar　to　100　mu　m　thickness)　with　only　2.1%　organics　is　developed　to　realize　low-temperature　bonding,　which　is　compatible　with　the　current　sintering　bonding　process.　The　optimized　preparation　parameters　of　the　nano-Ag　films　was　optimized　as　180　degrees　C-5　min.　The　characteristics　and　sintering　mechanism　of　nano-Ag　film　are　discussed.　The　results　showed　that　the　micro/nanostructure　on　the　surface　of　nano-Ag　film　with　a　small　amount　of　organic　material　is　responsible　for　the　low-temperature　sintering　ability,　which　realized　24.01　MPa　shear　strength　at　200　degrees　C.　The　fracture　was　analyzed　and　failure　modes　are　discussed.　The　easy-to-use　features　and　low-temperature　sintering　ability　make　the　nano-Ag　film　a　promising　die-attach　material　with　high　reliability.　[GRAPHICS]　.