FEA method in the 3D thermal simulation of MCM - Details

Author：

Hu, Xiuzhen (Hu, Xiuzhen.) | Li, Zhiguo (Li, Zhiguo.) | Guo, Chunsheng (Guo, Chunsheng.) | Wu, Yuehua (Wu, Yuehua.) | Liao, Jingning (Liao, Jingning.)

Indexed by：

EI Scopus PKU CSCD

Abstract：

The　reliability　of　multi-chip　module　(MCM),　especially　thermal　reliability,　has　become　one　of　the　keys　to　the　reliability　research　of　electronic　product.　Finite　element　analysis　is　an　important　tool　in　the　thermal　analysis　of　MCM.　A　three　dimensional　thermal　model　of　a　kind　of　MCM　was　built　with　ANSYS　to　calculate　the　temperature　distribution.　By　thermal　simulation　and　thermal　analysis,　we　can　raise　a　project　to　improve　the　temperature　field.

Keyword：

Thermoanalysis Temperature distribution Reliability Finite element method Computer simulation Multichip modules

Author Community：

[ 1 ] [Hu, Xiuzhen]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Li, Zhiguo]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Guo, Chunsheng]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Wu, Yuehua]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Liao, Jingning]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China

Reprint Author's Address：

Email：

xz.hu@emails.bjut.edu.cn

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Source ：

Chinese Journal of Semiconductors

ISSN： 0253-4177

Year： 2006

Issue： SUPPL.

Volume： 27

Page： 351-353

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 11

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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