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Author:

Liu, Boyang (Liu, Boyang.) (Scholars:刘波扬) | Guo, Chunsheng (Guo, Chunsheng.) | Wang, Sijin (Wang, Sijin.) | Wei, Hang (Wei, Hang.) | Wei, Lei (Wei, Lei.)

Indexed by:

EI Scopus

Abstract:

This paper proposes a novel method for online junction temperature measurement of silicon carbide metaloxide-semiconductor field-effect transistors (SiC MOSFETs). The measurement method is using the miller plateau voltage (VGS) and source leakage current (IDS) at transient inrush currents during turn-on process that based on the temperaturesensitive electrical parameters measurement method (TSEP). The comparison of infrared temperature measurement results shows that this method can provide more accurate junction temperature results and also can be used for transient junction temperature measurement in SiC MOSFET devices. It solves the problem that the traditional temperature-sensitive electrical parameter measurement method is difficult to measure the transient temperature rise. Finally, the results show that the use of VGS and IDS can provide more accurate junction temperature results which can be used for transient junction temperatures in SiC MOSEFT devices. © 2020 IEEE.

Keyword:

Leakage currents Parameter estimation Temperature measurement Power quality Electric variables measurement Semiconductor junctions Wide band gap semiconductors Semiconducting silicon compounds MOSFET devices Transients Silicon carbide MOS devices Electric network parameters

Author Community:

  • [ 1 ] [Liu, Boyang]Beijing University of Technology, Semiconductor Device Reliability Physics Laboratory, Beijing, China
  • [ 2 ] [Guo, Chunsheng]Beijing University of Technology, Semiconductor Device Reliability Physics Laboratory, Beijing, China
  • [ 3 ] [Wang, Sijin]Beijing University of Technology, Semiconductor Device Reliability Physics Laboratory, Beijing, China
  • [ 4 ] [Wei, Hang]Beijing University of Technology, Semiconductor Device Reliability Physics Laboratory, Beijing, China
  • [ 5 ] [Wei, Lei]Beijing University of Technology, Semiconductor Device Reliability Physics Laboratory, Beijing, China

Reprint Author's Address:

  • [guo, chunsheng]beijing university of technology, semiconductor device reliability physics laboratory, beijing, china

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Source :

Year: 2020

Page: 48-51

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 14

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