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Author:

Jin, Dongyue (Jin, Dongyue.) | Zhao, Xinyi (Zhao, Xinyi.) | Zhang, Wanrong (Zhang, Wanrong.) | Wang, Xiao (Wang, Xiao.) | Hu, Ruixin (Hu, Ruixin.) | Fu, Qiang (Fu, Qiang.)

Indexed by:

EI Scopus

Abstract:

In ord er to enhance the breakdown voltage of SiGe HBTs for high power application, the model of NPN SiGe HBT with superjunction collector is established with SILVACO TCAD. It is shown that the superjunction collector with iteratively vertical P layers and N layers will build up a lateral electric field to change the distribution of the electric field, reduce the peak ionization coefficient, and therefore enhance the breakdown voltage. However, the thermal effects of the device becomes more obviously as the voltage increases, which will lead to the thermal instability and hence limit the power handling capability of the device. Therefore, the layout of non-uniform finger spacing is further designed for thermal stability improvement. The increasing of the central finger spacing could effectively suppress the heat flow from adjacent fingers and enhance the thermal stability of novel device for power application. © 2014 IEEE.

Keyword:

Stability Electric breakdown Thermodynamic stability Si-Ge alloys

Author Community:

  • [ 1 ] [Jin, Dongyue]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Zhao, Xinyi]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Zhang, Wanrong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Wang, Xiao]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Hu, Ruixin]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Fu, Qiang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • [jin, dongyue]college of electronic information and control engineering, beijing university of technology, beijing; 100124, china

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Source :

Year: 2014

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 12

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