In-situ　observation　of　stress　in　Al　interconnects　under　electromigration　and　thermal　effect　by　using　the　synchrotron　radiation　x-ray　diffraction.　The　test　temperature　was　controlled　by　changing　the　current　density　of　W　(self-heating　structure).　The　EM-induced　stress　was　also　investigated　with　current　densities　from　3x105A/cm2　to　4x106A/cm2.The　conclusion　agreed　well　with　the　simulation　results.　©　(2014)　Trans　Tech　Publications,　Switzerland.