Study on the chip-level thermal non-uniformity evaluation of semiconductor devices - Details

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Abstract：

A　novel　method　is　proposed　to　evaluate　the　chip-level　thermal　non-uniformity　of　semiconductor　devices　by　electrical　transient　thermal　response　testing.　It　is　found　that　the　degree　of　integrated　chip　thermal　non-uniformity　could　be　determined　non-destructively　by　the　device　heating　response　curves.　©2009　IEEE.

Keyword：

Integrated circuits Failure analysis Failure (mechanical)

Author Community：

[ 1 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Zhang, Yuezong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Su, Rong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 5 ] [Xie, Xuesong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 6 ] [Ge, Chenning]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

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Email：

gchzhang@emails.bjut.edu.cn

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Related Keywords：

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Source ：

Year： 2009

Page： 541-544

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 2

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 8

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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