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Author:

Bai, Yun-Xia (Bai, Yun-Xia.) | Guo, Chun-Sheng (Guo, Chun-Sheng.) | Feng, Shi-Wei (Feng, Shi-Wei.) (Scholars:冯士维) | Ding, Kai-Kai (Ding, Kai-Kai.) | Zhuang, Si-Xiang (Zhuang, Si-Xiang.) | Su, Rong (Su, Rong.)

Indexed by:

EI Scopus

Abstract:

The specific application of power devices has imposed the requirement for intensive investigation of their reliability. In this paper we have investigated the reliability and failure mechanism of power VDMOS. In constant-stress accelerated life test, the three different temperatures (150C, 165C and 180C) are imposed on the devices. Under the bias VDS=7.5V, IDS=0.8A, and the channel temperature T=117C, the average lifetime is 3.67106 h, the activation energy E is 0.54eV, and the main failuremechanism is gate damage. ©2009 IEEE.

Keyword:

Failure analysis Testing Outages Integrated circuits Activation energy Failure (mechanical)

Author Community:

  • [ 1 ] [Bai, Yun-Xia]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Guo, Chun-Sheng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Feng, Shi-Wei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Ding, Kai-Kai]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Zhuang, Si-Xiang]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [Su, Rong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China

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Source :

Year: 2009

Page: 344-347

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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