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Author:

Ma, D. D. (Ma, D. D..) | Xia, G. D. (Xia, G. D..) (Scholars:夏国栋) | Jia, Y. T. (Jia, Y. T..) | Li, Y. F. (Li, Y. F..) (Scholars:李炎锋) | Wang, J. (Wang, J..)

Indexed by:

EI Scopus SCIE

Abstract:

This paper, for specific chips geometrics of 10 mm * 10 mm, the micro-channel heat sink is designed and optimized. Three dimensionless variables are defined as width ratio of chip to channel pitch (N), the width radio of channel to pitch (1) and aspect ratio (alpha(c) ). The optimal designs of MCHS based on minimum thermal resistance is performed at one or more constraint conditions of fixed inlet volume flow rate, fixed pressure drop and fixed pumping power. Results show the thermal resistance can reach smaller for fixed volume flow rates, but the pressure drop even increased to 350 kPa unacceptable in application. Similarly results are found for the fixed pressure drop or pumping power. Multiple constraint conditions are used to optimize channel sizes for a better thermal performance with acceptable pressure drop penalty. An interesting phenomenal is found the best thermal structure can be got of 200 ml/min, but not 400 mlimin under pressure drop less 50 kPa and pumping power less 0.5 W, which average temperature of 200 ml/min is 308.4 K, but 312.17 K of 400 mlimin. The required flow rate is from 146 to 225 ml/min and channel structures are N from 92 to 110,I = 0.6 and H, = 350 pm under limitations of pressure drop of 30-70 kPa and pumping power less 0.5 W. (C) 2017 Elsevier Ltd. All rights reserved.

Keyword:

Fluid flow Multiple constrain conditions Heat transfer Thermal optimization Micro-channel heat sink

Author Community:

  • [ 1 ] [Ma, D. D.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China
  • [ 2 ] [Xia, G. D.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China
  • [ 3 ] [Jia, Y. T.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China
  • [ 4 ] [Li, Y. F.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China
  • [ 5 ] [Wang, J.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 夏国栋

    [Xia, G. D.]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China

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Source :

APPLIED THERMAL ENGINEERING

ISSN: 1359-4311

Year: 2017

Volume: 120

Page: 247-256

6 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:165

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 24

SCOPUS Cited Count: 26

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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