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Author:

Pan, Shijie (Pan, Shijie.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Li, Xuan (Li, Xuan.) | Zheng, Xiang (Zheng, Xiang.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Hu, Chaoxu (Hu, Chaoxu.) | He, Xin (He, Xin.) | Bai, Kun (Bai, Kun.) | Zhou, Lixing (Zhou, Lixing.) | Zhang, Yamin (Zhang, Yamin.)

Indexed by:

EI Scopus SCIE

Abstract:

The effects of gamma irradiation on the electrical and trapping properties of AlGaN/GaN high-electron-mobility transistors (HEMTs) are investigated in detail. During the irradiation, the gate-source leakage current of the HEMT is monitored online when applying a reverse gate voltage. The variations of electrical properties of the device, including an increase in drain-source current, the negative threshold voltage shift, and a decrease of leakage current, are observed. In particular, three traps in the device are identified using the voltage-transient method and the variations of these traps after irradiation are also investigated. The results show that the absolute amplitudes of the three traps in the device decrease after irradiation, which indicates a reduction in the density of the traps. Furthermore, it is proposed that the time constants and energy levels of the three traps decrease after irradiation. The observed changes in the trapping behaviors are ascribed to the structural ordering of the defects, which is consistent with the improvement in the electrical characteristics of the device.

Keyword:

gamma irradiation voltage-transient method gallium nitride (GaN) trap high-electron-mobility transistors (HEMTs)

Author Community:

  • [ 1 ] [Pan, Shijie]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Xuan]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Zheng, Xiang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Lu, Xiaozhuang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 6 ] [Hu, Chaoxu]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 7 ] [He, Xin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 8 ] [Bai, Kun]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 9 ] [Zhou, Lixing]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 10 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

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Source :

SEMICONDUCTOR SCIENCE AND TECHNOLOGY

ISSN: 0268-1242

Year: 2021

Issue: 9

Volume: 36

1 . 9 0 0

JCR@2022

ESI Discipline: PHYSICS;

ESI HC Threshold:72

JCR Journal Grade:3

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count: 7

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

Affiliated Colleges:

Online/Total:1107/10537993
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