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Author:

Pan, Shijie (Pan, Shijie.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Li, Xuan (Li, Xuan.) | Zheng, Xiang (Zheng, Xiang.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | He, Xin (He, Xin.) | Bai, Kun (Bai, Kun.) | Zhang, Yamin (Zhang, Yamin.) | Zhou, Lixing (Zhou, Lixing.)

Indexed by:

EI Scopus SCIE

Abstract:

In this work, we developed the voltage-transient method to characterize the properties of traps in AlGaN/GaN high-electron-mobility transistors (HEMTs) in the OFF-state. By monitoring the drain voltage transients of the HEMTs at various temperatures, three types of trapping mechanism were identified: 1) buffer charge trapping, which occurred on a timescale of approximately 1 ms; 2) charge trapping in the AlGaN layer at the gate-drain edge with the energy level (E-a) of approximately 0.54 eV; and 3) surface charge trapping with E-a of approximately 0.28 eV. In particular, we extracted accurate amplitudes for the first two trapping behaviors and studied the dependence of the trapping effect on the filling bias conditions. The results showed that the buffer charge trapping was primarily affected by the drain voltage, whereas the charge trapping on the drain side of the gate was affected by both the drain and gate voltages; these results were verified by drift-diffusion simulations. In addition, we observed the third trapping behavior, which was apparent in the measurement window beyond 308 K, thus demonstrating the advantages of our method for correctly and effectively monitoring the changes in the peaks in the time constant spectrum.

Keyword:

Charge trapping high-electron-mobility transistors (HEMTs) differential amplitude spectrum (DAS) voltage transient GaN

Author Community:

  • [ 1 ] [Pan, Shijie]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Xuan]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 4 ] [Zheng, Xiang]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 5 ] [Lu, Xiaozhuang]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 6 ] [He, Xin]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 7 ] [Bai, Kun]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 8 ] [Zhang, Yamin]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China
  • [ 9 ] [Zhou, Lixing]Beijing Univ Technol, Coll Microelect, Beijing 100124, Peoples R China

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Source :

IEEE TRANSACTIONS ON ELECTRON DEVICES

ISSN: 0018-9383

Year: 2021

Issue: 11

Volume: 68

Page: 5541-5546

3 . 1 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:87

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 12

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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